By A. Fletcher
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Extra resources for Advanced Organics for Electronic Substrates and Packages
Silicone polymers are widely used if higher operating temperatures are required but they have cost penalties. In addition, epoxies wet and adhere well to many types of solid surface, giving them an advantage over polyimides. Organic materials have the major share - between 90% and 95% - of the market for electronic substrates and packaging. The degree of sophistication progresses from phenolic impregnated paper through the FR-2 and FR-4 glassfibre-epoxies used for printed circuit boards, to polyimides, the engineering thermoplastics and the advanced composites such as Placera - plastic ceramic composites.
An alternative process involves all layers being produced individually and then laminated at one time to produce the finished board. This is normally referred to as pin lamination as each layer has holes placed over pins to achieve registration of the various layers. Each layer of a multilayer PCB is called a core panel (or layer) and can be a signal core or power core. 508 mm thick. In addition to the cores, a finished laminate may require face sheets which are epoxy-glass laminates with copper on one side made by laminating several sheets of pre-preg with one sheet of copper foil.
Impregnation coating is used with a cavity filling or conformai coating 47 Advanced Organics process and involves the saturation of a low viscosity resin to the component, which also includes a thin film coated on the component surface. In dip coating the component is dipped into an encapsulant resin which is then withdrawn, dried and cured. Coating thickness is usually a function of resin viscosity, withdrawal rate and temperature of the resin. The most common method for IC device encapsulation is conformai coating, although spin coating and flow coating are also used.
Advanced Organics for Electronic Substrates and Packages by A. Fletcher